|About this Abstract
||Part C-1: Hydrometallurgy 2018
||Study of Electrochemical Behaviour and Surface Morphology of Copper Electrodeposit from Electrorefining with Lignin-Based Biopolymer and Thiourea as Additives
||Mohammad Mubarok, Rolf Andreas Lauten, Ross Ellis, Dani Ramdani, Mohammad Syaifuddin
|On-Site Speaker (Planned)
Effect of single addition of a lignin-based biopolymer additive of DP 2782 at various dosages as well as in combination with thiourea on cathode polarization during copper deposition was investigated by performing potentiodynamic and galvanostatic measurements using a potentiostat. The result of electrochemical measurements was compared with the behaviour of cathode deposition with glue and thiourea additives. Surface micro-appearance of the copper deposit after 1h galvanostatic scan under current density of 330 A/m2 and various additive type and dosage was evaluated by scanning electron microscopy (SEM) examination. It was found that the addition of biopolymer of 2.5 mg/l sufficiently gave polarizing effect of copper deposition. SEM examination of the cathode surface after galvanostatic scan revealed that the combination of the biopolymer with thiourea (2.5 mg/l and 3.5 mg/l) resulted in a compact deposit which is comparable with that resulted from the test with glue and thiourea.
||Planned: At-meeting proceedings