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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
Presentation Title Stretchable Wirings Prepared with PU and Silver Flakes
Author(s) Cai-Fu Li, Hao Zhang, Wanli Li, Zhi-Quan Liu, Katsuaki Suganuma
On-Site Speaker (Planned) Cai-Fu Li
Abstract Scope Stretchable electronics have gained much attention due to their potential applications in artificial skins and bio-integrated devices as well as other wearable devices. Stretchable conductive wirings with affordable cost and good conductivity are to meet the requirements for practical stretchable electronics. Herein we report a highly stretchable wiring prepared with Ag flakes and PU conductive paste. The resistivity of the wiring can reach as low as 1.6× 10 -5 Ω cm, which is one of the best values as those for stretchable conductive wiring materials. And the wiring can keep conductive even stretched up to 200 %. Furthermore, the resistance of the wiring can recover to when the strain is released. The fabrication process of the stretchable conductor enables printing and low temperature curing, which is very much suitable for the wide production of stretchable electronic devices.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3-D Printed Polymer-based Gas Sensors
3D Electronics and Sensor Circuits by Combining Conventional PCB Technology with Low Temperature Embedding and Forming
3D Printed Anodes for Al-air Batteries
3D Printing of Metals and Metal Oxides from Solution for Energy and Biomedical Applications
3D Printing of Soft Ionic Actuators/Sensors for Soft Robotic Applications
Additive Manufacturing with Aerosol Jet: From Prototyping to Production
Challenges in Gravure and Direct-write Printing of Nano-colloidal Inks
Delaminated Inkjet Printed Lines with Improved Electro-mechanical Behavior
High Performance Sensors and Antennas by 2D and 3D Printing of Nanoparticles
Highly Stretchable Metallic Interconnects on Polymer Substrates: Architecture and Mechanisms
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/C0529C03377A93C285258193005AA23F?OpenDocument">Integrated and Flexible Integrated and Flexible Biosensors for Point-of-care Diagnostics
[Replication or Save Conflict]
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Microheater Array Powder Sintering: A New Process for Printed Electronics
Nondestructive Examination Study in P(VDF-TrFE) Filter System and PM2.5 Spatial Resolution Technology by Using Synchrotron Transmission X-ray Microscopy
Printable Functional Materials for Smart Fabrics
Recent Advancement on Printed, Stretchable, and Wearable Electronics in 2D Materials
Room-temperature Aerosol Deposition of PLZT Films on Polymer Substrates
Single-crystalline-like Semiconductor Films on Flexible Substrates: A Route towards Roll-to-roll Manufacturing of High-performance Electronic Devices
Stretchable Wirings Prepared with PU and Silver Flakes
Structural-resolved Study Of Piezoelectric Properties Of P(VDF-TrFE) Films
Textile-enabled Wearable Energy Storage Devices
Transparent Field Effect Biosensors Printed on Highly Curved Surfaces
Ultrafast Pulsed Light Sintering of Thermoelectric Nanoparticles

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