|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Technical Division Student Poster Competition
||SPG-42: Choice of Intermetallic Compounds for Structural Applications in Near Submicron Joints
||Jen-Jui Yu, Jui-Yang Wu, Li-Jen Yu, C. Robert Kao
|On-Site Speaker (Planned)
Cu6Sn5 and Ni3Sn4 are common interfacial intermetallic compounds in electric packaging product and will potentially become candidates of structure materials in 3D IC micro joints. This study focused on the micromechanical behavior of single-crystalline of these two IMCs by method of micropillar compression in in-situ SEM. The in-situ images showed that both Cu6Sn5 and Ni3Sn4 could surprisingly deform plastically. Furthermore, the cross-section image of micropillar exposed by FIB showed that both Cu6Sn5 and Ni3Sn4 plastically deformed through slip along the certain crystallographic direction on certain crystallographic planes. It is interesting that these IMCs are not that brittle as we thought but tongue enough to accommodate the strain. In comparison of these two IMCs, Ni3Sn4 showed the better mechanical properties, i.e., the ultimate strength, strain to failure and Young’s modulus. Ni3Sn4 should be more promising to be employed as structure materials of 3D IC micro joints.
||Definite: None Selected