| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Effects of Minor Ni Doping on Interfacial Reaction and Microstructure Variation in the Cu/Sn-3Ag-0.5Cu-xNi/Au/Ni Sandwich Structure |
| Author(s) |
Chi-Yang Yu, Jenq-Gong Duh, Tae-Kyu Lee, Michael Tsai, Kuo-Chuan Liu |
| On-Site Speaker (Planned) |
Chi-Yang Yu |
| Abstract Scope |
Cu/Sn-3Ag-0.5Cu-xNi/Au/Ni (x= 0, 0.01, 0.05 and 0.1 wt.%) after reflow were aged at 100 oC and 150 oC, respectively, for 500 h. In the consideration of interfacial reaction, the local Ni concentration would affect the formation of intermetallic compounds (IMCs), i.e. (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4. The behavior of Ni migration before and after aging at different temperature was investigated with the aid of field emission electron probe microanalyzer (FE-EPMA). It was revealed that the morphology and growth rate of IMCs at both Cu and Au/Ni sides were rather different. During the heat treatment, cross-interaction was attributed to the Cu and Ni diffusion from one side to the other side between Cu and Au/Ni substrates. The variation in elemental distribution would cause microstructure evolution in these solder matrixes. In this study, the effects of minor Ni doping on interfacial reaction and microstructure variation in the solid state reaction will be reported. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |