|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Corrosion Resistance for High Reliability Devices
||Tsan-Hsien Tseng, Albert T. Wu
|On-Site Speaker (Planned)
High sulfur (S) and moisture environment causes corrosion in electronic components. It is crucial to develop a new coating of surface finishes on the printed circuit boards (PCBs). This paper proposes cobalt (Co) as a barrier layer to prevent corrosion in harsh environment. PCBs for automobile devices were coated with cobalt layers. Cross cut adhesion test showed that zero percent of the films were removed. Surface roughness was analyzed by atomic force microscope (AFM). It suggests that the EC process can modify the substrate surface morphology. Corrosion tests were performed in a chamber with high humidity. The relative humility was set at the range from 75% to 95% at a temperature between 80 and 150 oC. Dramatic surface corrosion can be observed without the coatings of Co. After the deposition of Co, the corrosion was inhibited and shows good corrosion resistance.
||Planned: Supplemental Proceedings volume