About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
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Materials Design and Processing Optimization for Advanced Manufacturing: From Fundamentals to Application
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Presentation Title |
M-17: Influence of Single Fold and Double Fold on the Stress and Strain of AMOLED Module |
Author(s) |
Qiujun Wang, Weiwei Su, Di Zhang, Weijin Ji, Bo Wang |
On-Site Speaker (Planned) |
Weijin Ji |
Abstract Scope |
Choosing the right bending method is an important way to optimize the flexible AMOLED. In this paper, a nonlinear finite element analysis method is used to propose and establish a drop shaped model in the double fold. This article focuses on the bending stress analysis of foldable panel, composed of plastic substrate PVA, adhesive layer, plastic layer PI, organic layer and conductive layer ITO to form a seven-layer laminated structure. Analysis and comparison of the stress conditions under single fold and double fold. In the case of double-folding, the overall mises stress will increase by 100MPa, which means that the double-folding model will experience more squeezing force than the single-folding model during use. The maximum stress in the Cover film is 670 MPa, while the single fold is 550 MPa. Through comparison, the single-fold model is more suitable for flexible AMOLED panel bending design. |
Proceedings Inclusion? |
Planned: |
Keywords |
Modeling and Simulation, |