About this Abstract |
Meeting |
2022 TMS Annual Meeting & Exhibition
|
Symposium
|
Characterization of Minerals, Metals and Materials 2022
|
Presentation Title |
Evolution of the Thermal Conductivity of Sintered Ag Paste as a Function of the Density, the Roughness of the Interface and Aging |
Author(s) |
Anas Sghuri, Yann Billaud, Loïc Signor, Pascal Gadaud, Didier Saury, Xavier Milhet |
On-Site Speaker (Planned) |
Anas Sghuri |
Abstract Scope |
This work presents a methodology to estimate the evolution of thermal conductivity of sintered silver deposited on pure copper, used as die-attach in the microelectronics industry. The study is based on a comparative assessment of the effect of silver porosity, interface roughness and aging on the conductivity of the material. The porosity and interface roughness are estimated by means of image analysis. The conductivity estimation method is based on solving an inverse problem by minimizing the squared deviation between the response of a 3D semi-analytical model and the measurement from a single flash-type experiment. The chosen estimator, known as ENH (Estimation by Normalization of Harmonics), consists in dividing the measurements by a reference harmonic. This method allows the simultaneous estimation of the in-plane conductivity components. The results of the experimental measurement of the thermal conductivity of sintered silver as a function of the density and aging are presented and discussed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Nanotechnology, Electronic Materials |