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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Young Professional "Meet the Candidate" Interactive Session
Presentation Title MC-9: Microelectronic & Nanoelectronic Packaging and Thermoelectric Devices
Author(s) Cheng-Chieh Li
On-Site Speaker (Planned) Cheng-Chieh Li
Abstract Scope My name is Cheng-Chieh Li, a Postdoctoral Fellow in Department of Materials Science and Engineering, Northwestern University. I received B. S. (2009) degree in department of Materials Sciences and Engineering from National Cheng Kung University, M. S. (2010) degree and Ph. D. degree (2014) in department of Materials Sciences and Engineering at National Taiwan University. My research experience includes: 1. Thermoelectric Materials and Power Generation Modules, 2. Themodynamics of Materials and Phase Equilibria, 3. Microelectronic & Nanoelectronic Packaging, 4. Mechanical Behavior and Failure Analysis of Materials. I have authored 15+ SCI journal and conference articles and been granted by awards, such as Outstanding PCB Thesis Award (2011), MRS-Taiwan Thesis Award (2012), TMS Best Paper Award (2014). Based on my experience and career goal, I believe it should be best suit for your academic position, government or R&D jobs. If further information is needed, feel free to contact me:
Proceedings Inclusion? Definite: None Selected


MC-11: Sivanesh Palanivel: Expertise in Processing, Additive Manufacturing, Characterization, and Computation
MC-12: Understanding Fatigue Mechanisms through Microstructural Control
MC-13: Nano-mechanical Behavior of High Entropy Alloy and Bulk Metallic Glass
MC-14: Microstructural Evolution and Mechanical Response by ‘Design and Modeling’
MC-15: Achieving Exceptional Properties in High Temperature Materials Using Friction Stir Processing (FSP)
MC-16: Friction Stir Welding of Aluminum 7000 Series Alloys
MC-17: Fabrication of Microchannel Monolithic Heat Exchanger Using Additive Manufacturing
MC-1: Seeking Broader Applications of Materials Science
MC-2: Controlling Microstructure for Smart Applications through FSP Advisor - Dr. Rajiv Mishra
MC-3: Experimental Micro and Nanoscale Mechanics with Microsecond Temporal Resolution for MEMS Applications
MC-4: A Engineer Fighting for 3D IC Development - Jen-Jui Yu
MC-5: Physical Metallurgist with Expertise in Computational and Experimental Techniques
MC-6: Nanomaterials for Energy Applications
MC-7: Metallugical Studies of Dr. Takahiro Kunimine
MC-8: Modeling of Microstructural Evolution Accompanying Phase Transformations
MC-9: Microelectronic & Nanoelectronic Packaging and Thermoelectric Devices

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