|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Ultrafine Grained Materials IX
||Effects of Length Scale on Creep Behavior of Bulk CuNb Nanolaminates
||Jaclyn Avallone, Tresa M Pollock, Thomas Nizolek, Nathan A Mara, Irene J Beyerlein
|On-Site Speaker (Planned)
Metallic multilayer systems are studied because of their promising performance in extreme environments. Properties are associated with the high density of bi-metallic interfaces, and therefore scale with the laminate layer thickness. Strength and resistance to damage by radiation or shock increase with decreasing length scale. The stability of the layered morphology at elevated temperature, however, has the opposite trend. It is necessary to determine how the creep properties of bulk metallic laminates vary with length scale in order to determine the optimal initial structure for use in high temperature structural applications. Copper-Niobium is a model laminate system because these immiscible materials have sharp interfaces and roll-bond well due to similar flow stresses. Bulk metallic laminates, with initial layer thicknesses of nominally 8000nm down to 28nm, are crept at 400℃. Results will be presented and discussed with respect to changes in behavior with microstructure length scale.