|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
||Mitchell Flynn, Chul-Min Oh, Sung-Dae Park, Hyun-Seung Yang, Jeong-Won Yoon, Tae-Kyu Lee
|On-Site Speaker (Planned)
The validation of new die attach materials is a matter of increasing concern as the limits of current lead-free solder are encountered. One such material is copper or silver coated copper microparticles used in a low temperature sintering process for power module application. Initial determinations are observed about the viability of a low temperature sintering process for copper paste based on electrical resistivity, thermal conductivity, and microstructure evolution. Formation of interconnections between the particles during the sintering process are observed based on pressure and temperature variation. It was observed that robust copper interconnections are formed under a 300°C sintering temperature for 1 hour with a 10MPa pressure application. The microstructure evolution during sintering and after post-processes are subjected for identification of residual stress, and local misorientation using electron backscatter diffraction (EBSD).
||Definite: At-meeting proceedings