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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Author(s) Mitchell Flynn, Chul-Min Oh, Sung-Dae Park, Hyun-Seung Yang, Jeong-Won Yoon, Tae-Kyu Lee
On-Site Speaker (Planned) Mitchell Flynn
Abstract Scope The validation of new die attach materials is a matter of increasing concern as the limits of current lead-free solder are encountered. One such material is copper or silver coated copper microparticles used in a low temperature sintering process for power module application. Initial determinations are observed about the viability of a low temperature sintering process for copper paste based on electrical resistivity, thermal conductivity, and microstructure evolution. Formation of interconnections between the particles during the sintering process are observed based on pressure and temperature variation. It was observed that robust copper interconnections are formed under a 300C sintering temperature for 1 hour with a 10MPa pressure application. The microstructure evolution during sintering and after post-processes are subjected for identification of residual stress, and local misorientation using electron backscatter diffraction (EBSD).
Proceedings Inclusion? Definite: At-meeting proceedings

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Fabrication of Stress Free Ni-Co Coatings Using Electroplating Method
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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