|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||The Kinetic Analysis of Co-Sn Binary System
||Chieh-Fu Chen, Mu-Tao Chen, Fan-Yi Ouyang
|On-Site Speaker (Planned)
Because Co and its alloy possess high wettability and great corrosion resistance, they are regarded as a potential alternative as diffusion barriers and under-bump-metallization (UBM) in the current electronic packaging fields. During assembly process, UBM would react with Sn alloys to form intermetallic compound (IMC). To predict the growth behavior of IMCs, the diffusion coefficient is an important intrinsic parameter. Because IMC is the near-stoichiometric compound, there is no concentration difference across the IMC; thus the diffusion coefficient is un-measureable. In this study, the interfacial reactions in Pb-free solder/Co couples during solid-state aging from 150C to 190C process were investigated. Through analysis of Wagner diffusivity and relative movement of Co-Sn IMCs, the intrinsic diffusion coefficient and activation energy of Co and Sn in IMC can be calculated.
||Planned: A print-only volume