|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Electromigration and Thermomigration in Eutectic SnBi Solder Joints
||Fu Guo, Limin Ma, Qian Liu, Yong Zuo, Jing Han
|On-Site Speaker (Planned)
Miniaturizing and high density packaging of microelectronic devices make electromigration and thermomigration become two of the most persistent reliability issues in interconnects. Thermomigration usually occurs with electromigration since a sufficient thermal gradient may be created by the inhomogeneous distribution of Joule heating. Thermomigration may assist or counteract electromigration depending on the direction of thermal gradient. Related literatures suggested that lead, bismuth and copper migrated toward the cold end while tin moved to the hot end. However, it’s a great challenge to distinguish contributions of thermomigration and electromigration because their effects may shadow each other. Therefore, it’s necessary to establish a direct relationship between thermal gradient and microstructural evolution. To solve this problem, this research designed a line symmetry solder structure and introduced the infrared imaging technique. The results could be of benefit to well recognize the effects of thermomigration and electromigration and better understand the fundamentals of them.
||Planned: A print-only volume