|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Alloys and Compounds for Thermoelectric and Solar Cell Applications V
||L-17: Micro Energy Harvesting Characteristics of Thermoelectric Thin-film Devices Fabricated Using Flip-chip Process
||Jae Hwan Kim, Tae-Yeol Lee, Dong-Hwan Kim, Jae-Ho Lee, Tae-Sung Oh
|On-Site Speaker (Planned)
Micro energy harvesting has been extensively investigated to provide auxiliary power sources for wearable devices. Among various potential power sources, thermoelectric thin-film devices have drawn attention because they can be operated by a small temperature difference with the advantages of high power density, no moving parts, and high reliability. However, bonding of the upper electrodes in a top substrate to thermoelectric thin-films in a bottom substrate for circuit formation is difficult to limit the realization of thermoelectric thin-film devices. Flip-chip process has a strong potential to be applied for fabrication of thermoelectric devices. In this study, we fabricated thermoelectric thin-film devices consisting of n-type Bi2Te3 and p-type Sb2Te3 thin-films with flip-chip process using Sn-In solder reflow as well as anisotropic conductive adhesive and compared their power generation characteristics. Acknowledgement: This work was supported by the Basic Science Research Program of the National Research Foundation of Korea (Project No. 2014R1A1A2004630).
||Planned: Supplemental Proceedings volume