|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||FF-4: Effects of Trace Addition of Phosphorus in Sn-Cu-Ni Solders
||M. A. A. Mohd Salleh, J. Read, Z. I. Abdullah, S. D. McDonald, K. Nogita
|On-Site Speaker (Planned)
||M. A. A. Mohd Salleh
Phosphorus is often added to wave-solder baths as an anti-oxidation agent for older generation eutectic Sn-37Pb solders. Despite this practice, there is little information on how phosphorus influences the solidification, final solder joint microstructure or dross volume/composition associated of new Pb-free solder alloys. The limited data  available shows there is an increase in the volume fraction of primary Sn dendrites and a decrease in the fluidity of Sn-0.7Cu-0.05Ni with the additions of 70, 200 and 800ppm P. In this paper, the effects of trace levels of phosphorus (lower than 70ppm P) in Sn-Cu-Ni solder alloys on solidification behaviour and microstructure along with dross characteristics has been investigated. It was found Ni-P intermetallic particles were formed in the solder and dross even after trace addition to Sn-0.7Cu-0.05Ni solders.
 K. Nogita, et.al., "Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder", Materials Transactions, 49, 3 (2008) 443-448.
||Planned: A print-only volume