This study attempted to explore the early stage behavior of the wetting interaction within the period before the wetting time, around 1 sec, with the wetting balance method. The high temperature Sn-Zn solders and epoxy were investigated, respectively, at 435℃ and ambient condition, for the wetting interaction with Cu. The wetting behavior at the early stage can be divided into two regions for the interactive solder system while a single region for the non-interactive epoxy system. Increasing of Ti addition into the solder increases the Cu-solder interaction force at the early stage and thus a large maximum wetting force. Consequently, the addition of Ti increases the thickness of the Cu-Zn intermetallic compounds, Cu5Zn8 and CuZn5.Meanwhile, the addition of Ti slows down the wetting interaction at the early stage, although increases the wetting force, that results in an increase in wetting time.