|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Thermal and Mechanical Stability of Nanocrystalline Materials
||Thermal Cycling Test of Integrated Fan-out Wafer Level Package with Highly (111)-oriented Nano-twinned Copper
||Li Yu-Jin, Ying Ju Chen, Kuan Ju Chen, Chih Chen
|On-Site Speaker (Planned)
In this study, we tested the thermal stability and fatigue resistance of normal copper and nano-twinned copper. We fabricated two kinds of copper lines on fan-out chips by electroplating. One is (111) nano-twinned copper and the other is normal electroplated copper. We controlled the thickness of the copper lines to be about 3um and 5um. Then the thermal stability test was tested in an oven with 250oC 350oC and 400oC in normal vacuum. In addition, multi-reflow and thermal cycling test (TCT) was performed. The results showed that the nano-twinned copper lines can be stable after high temperature annealing test. Also, nano-twinned copper showed excellent fatigue resistance after the TCT. Some cracks were observed by OM in the normal copper lines, but the nano-twinned copper lines was still perfect after test.
||Planned: Supplemental Proceedings volume