About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Nanostructured Materials in Extreme Environments
|
Presentation Title |
Interface Mediated Strain at High Temperatures |
Author(s) |
Shen J. Dillon |
On-Site Speaker (Planned) |
Shen J. Dillon |
Abstract Scope |
Coble introduced a model that is effective in predicting the rate of interfacial strain at relatively high applied stresses. Below some threshold stress, this model breaks down and the stress dependence of the strain rate generally follows a power law relationship. The physical basis for such a relationship remains poorly understood. In situ TEM-based high temperature interfacial creep experiments indicate that interfaces and grain boundaries do not typically contain the relatively high energy interfacial dislocations necessary to mediate creep. At low stresses, the kinetics tend to be nucleation rate limited up to stresses much higher than the onset of Coble creep in bulk materials. This talk seeks to rationalize the discrepancy between both the power law and exponential response and the relative magnitude of the stresses by considering the influence of microstructure on interface mediated creep. The result is a basic model utilized to understand or predict creep kinetics. |
Proceedings Inclusion? |
Planned: |