| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Effects of processing and amount of Co addition on shear strength and microstructural development in Sn-3.0Ag-0.5Cu solder joint |
| Author(s) |
Limin Ma, Feng Tai, Guangchen Xu, Fu Guo |
| On-Site Speaker (Planned) |
Limin Ma |
| Abstract Scope |
Co has been considered as one of the promising alloying elements to improve the strength and reliability of Pb-free solders, due to its high modulus values and good bonding with Sn. The characteristic microstructure and mechanical properties of Sn-3.0Ag-0.5Cu+XCo (X=0, 0.1, 0.2, 0.45 and 1.0 wt. %) solder joint with Cu substrate were investigated. This study was attempted to clarify the effects of different weight fraction of Co addition on solder joint. The change of undercooling degrees and solidifying phases of solder joints were investigated. An exploration of different solder joint fabrication methods, with both solder preforms and solder paste, was also carried out. The interfacial intermetallics layer stability and stress strength of the solder joints were systematically studied and compared with the control samples. The change in mechanical integrity of the solder joints were correlated with the microconstituents in the solidified solder joints. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |