|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Micromechanical Properties of Single Crystalline (Cu,Ni)6Sn5 by Micropillar Compression and Nanoindentation
||Jui-Yang Wu, C. Robert Kao
|On-Site Speaker (Planned)
3D IC micro joints could be entirely occupied by intermetallic compounds after assembly or operation of devices. In this study, the mechanical behaviors of Cu<SUB>6</SUB>Sn<SUB>5</SUB> IMCs with different crystallographic orientations were investigated by using the micropillar compression and nanoindentation. A correction method involving indenter compliance and sink-in effect was established for micropillar testing. The in-situ SEM images revealed that Cu<SUB>6</SUB>Sn<SUB>5</SUB> fractured along certain crystallographic planes. Besides, the anisotropy in mechanical properties of Cu<SUB>6</SUB>Sn<SUB>5</SUB> was also studied based on orientation image mapping using electron backscattered diffraction (EBSD). Furthermore, the addition of Ni could increase both hardness and elastic modulus of Cu<SUB>6</SUB>Sn<SUB>5</SUB>.
||Planned: Supplemental Proceedings volume