|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Micromechanical Properties of Single Crystalline (Cu,Ni)6Sn5 by Micropillar Compression and Nanoindentation
||Jui-Yang Wu, C. Robert Kao
|On-Site Speaker (Planned)
3D IC micro joints could be entirely occupied by intermetallic compounds after assembly or operation of devices. In this study, the mechanical behaviors of Cu6Sn5 IMCs with different crystallographic orientations were investigated by using the micropillar compression and nanoindentation. A correction method involving indenter compliance and sink-in effect was established for micropillar testing. The in-situ SEM images revealed that Cu6Sn5 fractured along certain crystallographic planes. Besides, the anisotropy in mechanical properties of Cu6Sn5 was also studied based on orientation image mapping using electron backscattered diffraction (EBSD). Furthermore, the addition of Ni could increase both hardness and elastic modulus of Cu6Sn5.
||Planned: Supplemental Proceedings volume