|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||The John Cahn Memorial Symposium
||Experimental Measures of Stress-coupled Boundary Migration and the Attendant Mechanical Behavior of Nanocrystalline Films
||Paul Rottmann, Suman Dasgupta, Kevin Hemker
|On-Site Speaker (Planned)
Stress-coupled grain boundary migration has been shown to trigger microstructural instability and accommodate plastic deformation in a wide number of nanocrystalline metals. The role of shear stress in promoting grain growth has been identified, but detailed information about local grain orientation and grain boundary character have been harder to obtain. TEM-based precession-assisted automated crystal orientation mapping (ACOM) now allows for nanoscale mapping of individual grains and grain boundaries. In situ mechanical tests, couypled with orientation mapping, have been used to make quantitative observations about twin formation, grain and twin boundary migration, and crack growth. The ability to observe and correlate these mechanisms with local orientation mapping, greatly facilitates comparisons with computer simulations and promotes better understanding of underlying deformation processes.