|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
||Yeonjin Baek, Li Li, Tae-Kyu Lee
|On-Site Speaker (Planned)
Press-fit connector pin is used for connection to a printed circuit board(PCB) into a conductive through-hole along with ball grid array(BGA). The press-fit pin subjected to compressive stresses in the PCB through hole provides the electrical and mechanical connection as an electrical connector on the printed circuit board. In this process, the press-fit connector pin is deformed and it causes mechanical and electrical instabilities. In this study, the mechanical and electrical properties of the press-fit connector pin were observed with post heat treatment and deformation. Micro 3-point bending test and the Knoop hardness test were used to investigate the yield strength and the hardness of the press-fit connector pin. The degradation mechanism for both mechanical and electrical are discussed with the change in deformation percentage, residual stress, grain spread, and local misorientation using electron backscatter diffraction (EBSD).
||Definite: At-meeting proceedings