ProgramMaster Logo
Conference Tools for Materials Science & Technology 2019
Register as a New User
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Abstract
Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Author(s) Yeonjin Baek, Li Li, Tae-Kyu Lee
On-Site Speaker (Planned) Yeonjin Baek
Abstract Scope Press-fit connector pin is used for connection to a printed circuit board(PCB) into a conductive through-hole along with ball grid array(BGA). The press-fit pin subjected to compressive stresses in the PCB through hole provides the electrical and mechanical connection as an electrical connector on the printed circuit board. In this process, the press-fit connector pin is deformed and it causes mechanical and electrical instabilities. In this study, the mechanical and electrical properties of the press-fit connector pin were observed with post heat treatment and deformation. Micro 3-point bending test and the Knoop hardness test were used to investigate the yield strength and the hardness of the press-fit connector pin. The degradation mechanism for both mechanical and electrical are discussed with the change in deformation percentage, residual stress, grain spread, and local misorientation using electron backscatter diffraction (EBSD).
Proceedings Inclusion? Definite: At-meeting proceedings


A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Fabrication of Stress Free Ni-Co Coatings Using Electroplating Method
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

Questions about ProgramMaster? Contact