| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Development of Sn-Ag-Cu-X Alloys For Electronic Assembly |
| Author(s) |
Adam J Boesenberg, Iver E. Anderson, Joel L. Harringa |
| On-Site Speaker (Planned) |
Adam J Boesenberg |
| Abstract Scope |
The global electronic assembly community is striving for a robust replacement for Pb-containing solders due to increased environmental regulations. A family of Pb-free ternary solder alloys based on Sn-Ag-Cu (SAC) compositions has shown promise for implementation; but issues in reliability in certain assembly and operating environments have arisen. Elemental (X) additions (Co, Ni, Mn, Zn, Al, Fe) to SAC3595 were analyzed for better understanding of heterogeneous nucleation mechanisms for greater control in joint solidification. Solderability on Cu of down-selected SAC+X alloys (Mn, Zn, Al) was tested using micro-wetting globual testing due to concern about increased oxidation during the reflow process. Minimization of the X concentration was investigated in simplified Cu joints by differential scanning calorimetry and joint microstructure analysis to determine undercooling effects and solidification morphology on single and multiple reflow cycles. Supported by Iowa State University Research Foundation and Nihon-Superior, Inc., through Ames Lab contract No. DE-AC02-07CH11358. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |