| About this Abstract |
| Meeting |
2016 TMS Annual Meeting & Exhibition
|
| Symposium
|
Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
|
| Presentation Title |
FF-8: The Effect of Aging Temperature on the Phenomena Occurring at the Interface of Solder SnZn with Na on Cu Substrate |
| Author(s) |
Tomasz Gancarz |
| On-Site Speaker (Planned) |
Tomasz Gancarz |
| Abstract Scope |
The aim of this study was to show the effect of aging time, temperature and Na addition to eutectic SnZn on the kinetics of formation and growth of the Cu5Zn8 and CuZn4 phases on Cu substrate. After a wetting test, the samples were aged at different temperatures for different times. Analysis of the microstructure of a cross section of the connection showed an NaZn13 phase in the solder matrix, which can reduce the diffusion rate of Zn atoms to the interface.
Acknowledgments
This work was financed by the National Science Centre Poland grant 2013/09/D/ST8/03991 „Physicochemical properties of Sn-Zn + (Al, Ga, Na) alloys” in the years 2014-2016. |
| Proceedings Inclusion? |
Planned: A print-only volume |