|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Study of Mechanical Properties in Aluminum Wedge-wedge Bonding
||Matt McKay, Madeleine Peauroi, Panthea Sepehrband, Jamie Ferris
|On-Site Speaker (Planned)
The effect of ultrasonic power on the evolution of mechanical properties during wedge-wedge wire bonding is studied. Aluminum wedge-wedge wire bond samples are prepared at varying ultrasonic power. At different levels of ultrasonic power, a relative change in mechanical properties is measured using vickers micro hardness tests and nanoindentation. A hardness profile of the bond is collected and used to compare the effect at different bonding powers as well as characterize mechanical properties as a function of distance from the wire substrate interface. The goal is to develop an understanding of residual hardening and softening in wedge wire bonding that results from the application of ultrasonic power. A MATLAB image analysis script is used for automated calculation of hardness results from the microhardness tests.
||Planned: Supplemental Proceedings volume