|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Technical Division Student Poster Competition
||SPG-12: Interfacial Reaction in Cu/Pb-free Solders during Solid-state Aging Process
||Chieh-Fu Chen, Fan-Yi Ouyang
|On-Site Speaker (Planned)
We systematically investigated the interfacial reaction between the Sn and the Co substrate and analyzed the growth mechanisms of the intermetallic compounds (IMCs) formed at the interfaces of the Sn /Co joints through different aging time. Only one reaction phase, CoSn3 phase, is formed in this system. The IMCs layer grows thicker with longer reaction time and higher reaction temperatures. To predict the growth behavior of IMCs, the diffusion coefficient is an important intrinsic parameter. Because IMCs is the near-stoichiometric compound, there is no concentration difference across the IMCs; thus the diffusion coefficient is un-measureable. In this study, the interfacial reactions in Sn/Co couples during solid-state aging from 150C to 190C process were investigated. Through analysis of Wagner diffusivity and relative movement of Co-Sn IMCs, the intrinsic diffusion coefficient and activation energy of Co and Sn in IMCs can be calculated.
||Definite: None Selected