|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Lead Free Solder Joint Open Failures Post Multiple Reflows due to Void Generation and Accumulation
||Yan Li, Olen Hatch, Pilin Liu, Deepak Goyal
|On-Site Speaker (Planned)
The surface mounting of a small form factor passive package on the CPU package using ball grid array (BGA) is evaluated. However SAC solder joint open failures were found between the bulk solder and the substrate pads of the passive packages post multiple reflow cycles. To understand the failure mechanism, progressive 3D X-ray computed tomography was used to image the same solder joints at time zero and post each reflow cycle. It was found that voids due to the phase transformation of intermetallic compounds started to form post one reflow cycle and merged to form cracks. Characterization studies of the pad surface finish, included Focused Ion Beam (FIB) cross section, scanning electron microscopy (SEM) and Energy-Dispersive X-ray spectroscopy (EDX), before and after solder ball attachment revealed the correlation between plating defects and voids in solder joints. Failure mechanism of the solder joints post multiple reflow cycles will be discussed.
||Planned: A print-only volume