|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Effect of Bump Height on Grain Size and Orientation of Solder Microbumps Bonded by Thermal Compression
||Yu-An Shen, Chih Chen
|On-Site Speaker (Planned)
The anisotropically properties of β-Sn crystal affect the reliability of Sn-rich solders. In previous studies, grain orientation affects the electromigration failure because Cu/Ni atoms diffuse quickly along the  of Sn. And grain boundaries became the channels for the quickly formation of intermetallic compounds. However, there are inadequate studies on this issue. In this study, we investigated the grain size and orientation in 30-μm-diameter and Sn-2.3Ag solder microbumps with the 10, 15, 20 μm bump heights assembled by thermal compression bonding. The under bump metallurgy (UBM) layers of all are Cu-Cu (both thicknesses are 5 μm thickness). By electron backscattered diffraction (EBSD) analysis, the distribution of the grain size and orientation of microbumps was measured. Among the three bump heights, 45% the 20-μm-thick microbumps are single-crystal like and 70% the 15-μm-thick microbumps are single-grain like. More results in the microstructures will be discussed in the presentation.
||Planned: A print-only volume