|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Alloys and Compounds for Thermoelectric and Solar Cell Applications VI
||Role of Ni-Mo Diffusion Barrier on the High Temperature Stability of PbTe Based Thermoelectric Module
||Sundararajan Govindan, D Sivaprahasam, Raghavan Gopalan
|On-Site Speaker (Planned)
Integration of the present day high figure of merit (ZT) thermoelectric materials into modules usable in medium temperature range (400-600 C) applications requires a stable joints between the thermoelectric elements and the metallic interconnect at the hot side. The inter-diffusion at the interface and the stress due to thermal expansion coefficient mismatch are some of the major factors affecting the stability of the joints. In this study, we investigate the effect of Ni-Mo diffusion barrier layer on the stability of the joint between PbTe and Cu/Ni interconnect. The p- and n- type compounds with ZT more than 1 prepared by spark plasma sintering of powder synthesized by melting and ball milling is deposited with Ni-Mo layer by sputtering and electro-deposition and joined to Cu by n-Ag paste. The microstructures of the as prepared joints, after annealing at 500C are investigated and their effects on the thermoelectric elements performance are discussed.
||Planned: Supplemental Proceedings volume