| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Effect of Pb Addition on Creep and Tensile Behavior of SAC 305 Solder |
| Author(s) |
Jonathon Paul Tucker, Carol A. Handwerker, Ganesh Subbarayan |
| On-Site Speaker (Planned) |
Jonathon Paul Tucker |
| Abstract Scope |
Comprehensive characterization of the mechanical behavior of Pb-mixed SAC solders is necessary to understand the reliability of reworked legacy components and mixed assemblies. Three alloys of 1, 5 and 20 weight percent Pb were selected so as to represent reasonable ranges of Pb contamination expected from different Sn-Pb components reworked with Sn3.0Ag0.5Cu. Monotonic and creep tests were performed on specially designed assemblies at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. The observed changes in creep and tensile behavior with Pb addition were related to phase equilibria and microstructure differences observed through DSC and SEM cross section analysis. With increasing Pb content, the steady state creep strain rates increased while primary creep decreased. The experimental data were used to fit for the parameters of the rate-dependent constitutive models. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |