|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Pressureless Ag Sintering Process for IPM Modules
||Chulmin Oh, Dajung Kim, Yoonhwa Choi, Won Sik Hong
|On-Site Speaker (Planned)
In recent years, next-generation wide bandgap (WBG) power devices such as SiC or GaN have been adopted in the power module due to excellent thermal performance. WBG power devices, however, have searching the interconnection technologies usable at high operation temperature, instead of soldering method. We have developed pressureless Ag sintering process as an alternative interconnection technology to apply in the intelligent power module(IPM). Ag sintered paste was printed by manual screen printer and the SiC devices were bonded on DBC substrate without any pressure at relatively low temperature of 250 ˚C in vacuum oven. To investigate the void of Ag paste and bonding strength, 2D X-ray and die-shear tester were used. Interface microstructure was also observed by scanning electron microscopy (SEM). On the basis of our results, we can realize reliable power SiC IPM module by introducing pressureless Ag sintering process.
||Planned: Supplemental Proceedings volume