| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Effects of Co Addition upon Sn-8.8Zn/Cu and Sn-57Bi/Cu Interfacial Reactions |
| Author(s) |
Yu-chih Huang, Sinn-wen Chen |
| On-Site Speaker (Planned) |
Yu-chih Huang |
| Abstract Scope |
Eutectic Sn-Zn and Sn-Bi alloys are promising Pb-free solders, and Cu is commonly used in electronic products. Interfacial reactions between Cu substrate and Sn-Zn and Sn-Bi solders are investigated at 230 and 160<SUP>o</SUP>C. Two different sizes of solders, 2mg and 2g, added with different amounts of Co (up to 0.5%) are examined. The reaction products in the couples prepared with the two kinds of solders are not changed with the addition of Co, and they are γ-Cu5Zn8 and η-Cu6Sn5 phases, respectively. With and without Co addition, the γ-Cu5Zn8 phase in the Sn-Zn-(Co)/Cu couple is layer structure, and it is found that the growth rate of γ-Cu5Zn8 phase decreases with higher Co addition and smaller sizes of joints. On the other hand, the morphology of η-Cu6Sn5 phase becomes porous with the Co addition. The growth rate of η-Cu6Sn5 increases with higher Co addition, but it decreases with smaller sizes of joints. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |