|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Advances in High Temperature Pb-Free Composite Solder Paste Research
||Stephanie Choquette, Iver Anderson
|On-Site Speaker (Planned)
A promising Cu-Ni/Sn lead-free alternative to high-Pb solder has continued to be developed toward improvement of the reliability of PCB/SMT solder joints at temperatures greater than 300˚C. Previous issues with porosity have been addressed by decreasing the viscosity of the powder composite paste blend. Also, the Ni addition has been optimized by adjusting the Cu-10Ni fraction. The prototype paste reflows at 250˚C and forms the ductile IMC (Cu,Ni)6Sn5, dictating the solder paste’s post-reflow melting temperature of 525°C. New research on optimizing the powder ratio of the paste blend, exploring limits of the paste’s reflow profile, decreasing void formation in the joint, and variations in IMC composition will be reported. Results suggest that this composite paste could be an excellent “drop-in” replacement for the Pb-based high-temperature solders soon to be eliminated by RoHS. Support from the Iowa State Research Foundation and Nihon-Superior, Inc. Ltd., through Ames Lab (DE-AC02-07CH11358) is gratefully acknowledged.
||Planned: Supplemental Proceedings volume