|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||Influence of Corrosive Electrolyte on the Electrochemical Behavior of Cu(Pd)-Al IMCs
||Yuelin Wu, Andre Lee
|On-Site Speaker (Planned)
Through the transition from Au to Cu as the bonding wire, a major reliability concern is the electrochemical interactions between metallic wire with various Cu-Al IMCs. Pd-coated Cu wire has been suggested by industry to improve service reliability, but fundamental electrochemical behavior of various entities has not been fully investigated. Here different Cu(Pd)-Al IMCs were synthesized using arc-melting method. Electrochemical properties in free corrosion condition such as open cell potential and potentiodynamic polarization measurements were conduct at corrosive electrolytes with varying conductivities at different pH. Results suggested that lower pH and higher chloride concentration contributed to higher corrosion rate, and small amount of Pd addition decreased the tendency of IMC to corrode but seemingly increase the rate of corrosion. Galvanic corrosion studies were also conducted to confirm the failure mechanisms in wire bonded electronic packages.
||Planned: A print-only volume