About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Aluminum Alloys, Characterization and Processing
|
Presentation Title |
Exploring Semi-solid Deformation of Al-Cu Alloys by a Quantitative Comparison between Drained Die Compression Experiments and 3D Discrete Element Method Simulations |
Author(s) |
Te-Cheng Su, Meng-Chun Chen, Huai-Ren Hu, Ying-Hsuan Ko, Ling-En Yao |
On-Site Speaker (Planned) |
Te-Cheng Su |
Abstract Scope |
Developing computational modeling for the semi-solid aluminum alloys with a solid network can help optimize advanced pressurized casting processes such as die-casting, squeeze casting, twin-roll casting, and semi-solid forging. However, a comprehensive numerical approach that can capture the coupled behavior between grain rearrangement and deformation of each individual grain remains a significant challenge. Inspired by recent synchrotron imaging work on deforming equiaxed-globular Al-Cu alloys showing granular deformation mechanisms, this research uses the 3D discrete element method (DEM) to generate two numerical assemblies of primary aluminum grains with volumetric solid fraction 0.52 and 0.82, respectively. Burger’s contact model is introduced to consider viscous interactions between two grains at high temperature. Contact model parameters are found by an iterative approach to reproduce the rheological response of drained die compression experiments. Validated 3D DEM simulations will be useful for exploring the relationship between deformation process parameters and strain localization of a bulk semi-solid. |
Proceedings Inclusion? |
Planned: Light Metals |
Keywords |
Solidification, Modeling and Simulation, Aluminum |