|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||K-3: Mechanical Properties and IMC Morphology of Sn-58Bi Solder Including Sn-decorated MWCNTs
||Hyun-Joon Park, Kyung-Deuk Min, Choong-Jae Lee, Seung-Boo Jung
|On-Site Speaker (Planned)
Mechanical properties and morphology of intermetallic compound (IMC) of Sn-58Bi (in wt.%) solder including various Sn-decorated multi-walled carbon nanotubes (MWCNTs) contents (0, 0.05, 0.1 and 0.2 wt.%) were investigated. Sn-58Bi solder pastes including Sn-decorated MWCNTs were printed on organic soderability preservative (OSP) surface treated substrates (FR-4 printed circuit board) and bonded to the substrates in reflow process (1, 2, 3, 5 and 7 times respectively). This study reported the effects of Sn-decorated MWCNTs contents and the number of reflow process on mechanical properties and IMC morphology of Sn-58Bi solder. In the ball shear test, shear strength and fracture energy increased with increasing contents of Sn-decorated MWCNTs up to 0.1 wt.% and increase in the number of reflow process did not significantly affect the solder joint reliability. In addition, the thickness of IMC of Sn-58Bi solder increased with increasing the number of reflow process.
||Planned: Supplemental Proceedings volume