|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Fatigue in Materials: Fundamentals, Multiscale Modeling and Prevention
||L-72: Creep, Damage and Fatigue Failure of Sn3.0Ag0.5Cu Solder Joints
||Travis Dale, Dennis Chan, Chaitra Chavali, Carol Handwerker, Ganesh Subbarayan
|On-Site Speaker (Planned)
SnAgCu alloys exhibit complex microstructural aging that affect both their creep response and fatigue resistance over the life of the joints. We will describe the development of microstructurally adaptive constitutive models for creep response of Sn3.0Ag0.5Cu solder joints. The developed model identifies microstructural parameters that critically influence the mechanical response as a result of aging, and accurately predicts the creep response for a given microstructural state. The foundational physical principle of maximum entropy is used to describe damage accumulation in ductile solids. The theory results in a single parameter exponential damage accumulation model. The damage model parameter is obtained through isothermal cyclic fatigue tests. For both the constitutive model and the life model, a high precision micromechanical tester was used to perform monotonic, creep, and fatigue tests on Sn3.0Ag0.5Cu solder joints under various aging and testing conditions.
||Planned: Stand-alone book in which only your symposium’s papers would appear (indicate title in comments section below)