|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Effect of Copper Wire Diameter on the Variation in Shear Mode and Shear Strength
||Patrick McCluskey, Subramani Manoharan, Christian Runyon, Stevan Hunter
|On-Site Speaker (Planned)
Copper wire bonding requires careful process optimization to develop high quality bonds. This study focuses on determining the relationship between shear strength/shear mode and both different wire diameters and bond pad thicknesses. It has been found that thicker pads lead to higher shear strength for 18um diameter wires. However, with an increase in wire diameter, the failure mode in shear shifts, leading to a different shear strength versus pad thickness trend. To further characterize these effects, 3 bond pad thickness are used for wire bonding with 2 wire diameters (viz. 18um and 25.4um). Twelve bonding recipes (e.g. force, time, and power) are used for each of the wire diameters. Bond shear strength, shear mode, IMC coverage and ball bond diameter are evaluated in this study as a function of wire diameter, bond pad thickness and bonding process parameters.
||Planned: Supplemental Proceedings volume