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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Presentation Title Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Author(s) Kuan-Ju Chen
On-Site Speaker (Planned) Kuan-Ju Chen
Abstract Scope We used a waveform called periodic reverse (PR) electroplating that adding an extra anodic step into DC waveform to fabricate nt-Cu film. We found that the forward/ reverse current density ratio and duty cycle both influenced the microstructure and grain growth behavior of Cu film. When annealing at 400░C with same film thickness, it showed that increasing the reverse time will cause the abnormal grain growth occurs more easily. But when annealing at 250░C, the results were different to the former one. At first, with increasing the reverse time, the thermal stability of nano twin decayed. But there would be an inflecting point that after the reverse time surpassed this point, the thermal stability of nano twin would be very stable. This behavior suggested the grain growth behavior of nt-Cu film can’t be explained by the Thompson and Carel model.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
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