| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Reaction between Sn and Electroplated Cu Foils with Different Orientation |
| Author(s) |
Tzu Sung Huang, C Y Liu, Hua-wei Tseng, Yu-Hsiang Hsiao, Cheng Tze Liu |
| On-Site Speaker (Planned) |
Tzu Sung Huang |
| Abstract Scope |
The binary Cu/Sn soldering system is the most important joint system in the current IC packaging. In this thesis, we will study the correlation between the microstructure of Cu substrate (Cu grains size and preferred orientation) and the interfacial reaction (Cu-Sn compound formation and Kirkendall voids distribution). Cu substrates with different orientation are prepared by electroplating, and then reflow solder balls on the electroplated Cu substrates. After that, aged the Sn/Cu samples under 150℃. In this investigation, the electroplated Cu were performed by metallurgical examination, XRD and FIB analysis to examine the grain size morphology, preferred orientation and Kirkendall voids distribution. The experimental results indicated that the Cu3Sn thickness of Cu substrate with the (Random) plane is thicker than that with the (111) and (220) planes. In addition, there was almost no Cu3Sn growth in (111) and (220) after 2000 hrs aging. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |