|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||FF-3: Effect of Bi on Mechanical Properties and CTE of Pb-free Solders
||Selena Smith, Yueqin Wu, Mohd Arif Mohd Salleh, Christopher M. Gourlay, Sergay A. Belyakov, Stuart D. McDonald, Kazuhiro Nogita
|On-Site Speaker (Planned)
Sn-0.7wt%Cu is a well-known base alloy used in Pb-free soldering. While it exhibits good soldering properties, further modifications are required to improve performance in thermal cycling. This research investigates the effects of minor additions of Bi (0-2wt%) to Sn-0.7Cu and Sn-0.7Cu-0.05Ni solder alloys. Solid solution strengthening and the effect on the anisotropy of Sn will be investigated using crystallography controlled nano-indentation for mechanical property characterisation including hardness and elastic modulus. The coefficient of thermal expansion (CTE) of the Sn phase and its degree of anisotropy as a function of Bi concentration is investigated using temperature controlled synchrotron XRD. This approach aims to improve the mechanical and thermomechanical properties of the alloys and potentially improve solder joints reliability, especially during thermal cycling.
||Planned: A print-only volume