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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Presentation Title High Temperature Mechanical Properties of Zn-based High Temperature Lead-free Solders
Author(s) Che-Wei Chang, Kwang-Lung Lin
On-Site Speaker (Planned) Che-Wei Chang
Abstract Scope This study investigated the microstructure and high temperature, 100oC, tensile properties of the high temperature Pb-free solder Zn25Snx(x ≦0.04)Ti. The addition of Ti was found to refine the microstructure of the Zn-rich phase. The high temperature ultimate tensile strength of the solder is around 32 MPa, irrespective to the Ti content. The total elongation of the solders, however, changes between 35% and 49% with maximum magnitude at 0.01%Ti. The solders with Ti contents between 0.01% and 0.03% exhibit better elongation performance than the Zn25Sn solder. The total elongation of 0.04%Ti containing solder is lower than that of the Zn25Sn solder, 35% versus 37%. An excess addition of Ti will cause segregation of the Sn-rich phase. The segregation of the Sn-rich phase at higher Ti content is believed to be responsible for the degradation in elongation. The fractographs of the solders at high temperature were investigated.
Proceedings Inclusion? Planned: Supplemental Proceedings volume

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