|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The Grain Orientation Evolution of Mixed Solder Joints with Single-crystal Grain at the Same Position of BGA Packages during Thermal Shock
||Jing Han, Fu Guo, Shihai Tan
|On-Site Speaker (Planned)
The mixed solder joints in BGA packages were made by soldering Sn3.0Ag0.5Cu solder balls on the Printed Circuit Board, and the solder paste was eutectic SnPb. And BGA packages were cross-sectioned prior to thermal shocks to obtain grain orientations of the initial state, and the grain orientation after thermal shock were detected by in-situ observation using Electron Backscattered Diffraction. In this paper, a few solder joints with single-crystal grain at the same position of BGA packages were selected to investigate the grain orientation evolution and recrystallization. The results showed that the orientation evolution and recrystallization maybe correlated with the angle between c axis of Sn crystal and the load direction of thermal stress caused by mismatched coeffient of thermal expansion during thermal shock. And the orientation evolution and recrystallization became more serious with the decreased angle between c axis of Sn crystal and the load direction.
||Planned: Supplemental Proceedings volume