|About this Abstract
||Materials Science & Technology 2011
||Interfaces, Grain Boundaries and Surfaces from Atomistic and Macroscopic Approaches -- Fundamental and Engineering Issues
||Grain Boundary and Orientation Effects on the Growth of Tin Whiskers
||Aaron Pedigo, Pylin Sarobol, Carol Handwerker, John Blendell
|On-Site Speaker (Planned)
While it is clear that the global texture has a strong effect on the density and type of defects that form on electroplated Sn finishes on Cu substrates, determining the conditions and the grain boundary misorientations that induce whisker growth has been elusive. One issue is to determine which grains will form defects and whether these defects will be whiskers or hillocks (which are relatively benign). The transition from whisker to hillock has been related to the mobility of the grain boundaries, with pinned boundaries necessary for extensive whisker growth. What is not clear is the nature of the microstructure and stress levels at the defect nucleation site. We have made measurements of the strains around individual whiskers and grain orientations using the ALS synchrotron as a function of time. From these measurements the local conditions necessary for the nucleation of defects and the growth of whiskers can be determined.
||Definite: A CD-only volume