|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||The Materials Science of Solder Joints in Cu Pillar/Interposer Geometries
||Francis Mutuku, Mohammed Genanu, Babak Arfaei, Eric Cotts, Eric Perfecto
|On-Site Speaker (Planned)
The effect on Pb free solder joint microstructure and performance of the variation of processing parameters such as thermal history, or composition, depends strongly upon geometry. The advent of 2.5/3D technologies in microelectronics has decreased length scales, and changed aspect ratios. This decrease of solder volumes dramatically affects the solidification microstructure of near eutectic SnAgCu solder, and increases the focus on the formation of intermetallic compounds at solder/metallization interfaces. In the current study, relations between processing, microstructure and reliability of assemblies enabled through Cu pillar/interposer technology were examined. The effects of solder cap composition, thickness and volume on the microstructure of Cu pillar assemblies were examined. Precipitate and Sn grain morphologies, intermetallic compound crystal structures and morphologies, were quantified, and correlated with both shear strength and with performance in accelerated thermal cycling tests. Comparisons with results from studies at much larger length scales (ball grid array) are reported.
||Planned: Supplemental Proceedings volume