About this Abstract |
Meeting |
2021 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2021)
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Symposium
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Materials
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Presentation Title |
Selective Laser Melting of Metal Cooling Devices onto Silicon |
Author(s) |
Arad Azizi, Fatemeh Hejripour, Matthew Heitner, Nasim Anjum, Vahideh Radmard, Najmeh Fallahtafti, Srikanth Rangarajan, Changhong Ke, Bahgat Sammakia, Scott Schiffres |
On-Site Speaker (Planned) |
Arad Azizi |
Abstract Scope |
A process for selective laser melting of metal onto silicon is demonstrated. Freeform structures on silicon devices can serve as single or two-phase heat sinks, or vapor chambers. This process will remove the thermal bottleneck of the thermal interface material that bridges the gap between silicon chips and heat sinks. This work overcomes the relatively weak bonding of metals onto silicon. By introducing an interlayer alloy (Sn3Ag4Ti), the wettability and bonding properties of these substrates with metals improves considerably without the need for any metallization. Furthermore, the low melting point of Sn3Ag4Ti reduces the thermal stresses at the interface during solidification. The developed process overcomes several key challenges relating to the speed of bonding and preventing thermal-stress damage. Simulations of the melting process will be related to the process parameters and the experimentally measured bond strength. Potential benefits of this technology to cooling in high performance computing will be discussed. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |