|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Interfacial Reactions between Tin and Ni-coated Bi2Te3
||Yu-Chen Tseng, Chih-Ming Chen
|On-Site Speaker (Planned)
Bismuth telluride (Bi2Te3) is well-known for its great thermoelectric ability of converting heat to electricity at room temperature. Numerous efforts have been thrown into improving the figure-of-merit, but only few studies exploit the solder joint reactions that can provide fundamental information for the reliability assessment. Knowing that the Bi2Te3 element made by zone-melting possesses a unidirectional crystal structure, the effects of anisotropic crystal orientation on the interfacial reactions between Sn and Ni-coated Bi2Te3 element were investigated. Ni was electroplated on the Bi2Te3 element as a diffusion barrier and joined to Sn in a direction perpendicular or parallel to the atomic layer direction of the Bi2Te3 element. The formation, microstructure, and growth kinetics of the intermetallic compounds formed at the Bi2Te3 solder joints will be discussed in the presentation.
||Planned: A print-only volume