|About this Abstract
||Materials Science & Technology 2012
||MS&T'12 Poster Session
||H5: Modeling of the Bending Actuation of a Shape Memory Composite
||Pedro Cortes, John Terzak, Amber J.W. McClung, Jeffery W. Baur
|On-Site Speaker (Planned)
The present paper investigates the model that predicts the bending actuation properties of a Shape Memory Composite (SMC) based on a Shape Memory Polymer (SMP) and Shape Memory Alloy (SMA) wires. The proposed model determines the volume fraction of SMA in the SMC to properly balance the activation forces caused by temperature changes in the system. The activation forces are caused by the glass transition temperature (Tg) of the polymer as well as by the Martensite-Austenite transition within the Alloy. The modeling has been conducted by two methods. The first using ANSYS Finite Element Software (FEA). The second using classical mechanical theory. The modeling include the temperature effects on the mechanical properties of both materials in the composite, the most prevalent being the Elastic Modulus and the coefficient of thermal expansion.
||Definite: A CD-only volume