|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Rare Metal Extraction & Processing
||D-55: Experimental Modeling of Nodulation in Copper Electrorefining
||Yuya Nakai, Ken Adachi, Atsushi Kitada, Kazuhiro Fukami, Kuniaki Murase
|On-Site Speaker (Planned)
Concerning nodulation in copper electrorefining, it has been reported that the short circuit caused by nodulation has the largest impact on the current efficiency. Therefore, to improve the current efficiency, it is important to prevent nodulation. In this research, the nodulation growth has been investigated by replicating nodulation in the laboratory scale. The experiments are conducted by cathodic electrodeposition on the copper plate, and on each of them, a copper stick with various heights is attached. The nodulation has been analyzed in terms of growth rates versus the initial heights. It was revealed that there is a close relationship between the nodulation growth and the convection which causes the meeting of electrolyte flow to the tip of the nodule.