|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Surface Engineering for Improved Corrosion Resistance
||Corrosion Behavior of CP-copper with CG and UFG Grain Size after Irradiation by High Current Pulsed Electron Beam
||Yue Zhang, Fuyang Yu, Fuyu Dong, Shengzhi Hao, Jingtao Wang, Chuang DONG
|On-Site Speaker (Planned)
ABSTRACT: As one of the surface modification methods, high current pulsed electron beam (HCPEB) has attracted attentions on its potential on the surface corrosion and wear. The present work investigated the corrosion behaviors of CP copper with CG and UFG grain size by HCPEB modification. From electrochemical experiments in a 3.5% NaCl solution, the potential of both CG-Cu and UFG-Cu were shifted into lower values after HCPEB irradiation, which revealed an enhanced passive behavior ion the modified surface. The microscopic results showed that, the corrosion is mainly intergranular and selective deep pitting in the CG-Cu, while there is a clear pitting mechanism on the corrosion surface in both UFG-Cu and those modified by HCPEB. As on the corrosion surface of UFG-Cu by HCPEB, smaller amount and shallower pitting were observed. The improvement on the surface corrosion was related to the homogenization of the microstructure and chemical composition achieved by HCPEB.
||Planned: Supplemental Proceedings volume