|About this Abstract
||Materials Science & Technology 2019
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
||David Routledge, Tae-Kyu Lee
|On-Site Speaker (Planned)
Thermal fatigue is a common cause of failure in electronic interconnects and therefore electronic devices. One of the issues of investigating the reliability of a device against failure through thermal fatigue is that this process requires thermal cycling, which is a slow process. Instead, mechanical cycling of individual interconnects at elevated isothermal temperatures may be sufficient to simulate the effects of thermal cycling, but at a much-improved testing rate. This would provide a forensic investigator a method to rapidly test for the effects of thermal fatigue within the timeframe of a fast-moving failure investigation. This preliminary work aims to quantify how much of an effect temperature has on the mechanical fatigue life of lead-free solder balls.
||Definite: At-meeting proceedings